基本信息
源码名称:nxp5744芯片数据手册(MPC5744P.pdf)
源码大小:1.73M
文件格式:.pdf
开发语言:C/C++
更新时间:2020-12-29
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源码介绍
nxpMPC5744芯片数据手册
nxpMPC5744芯片数据手册
Table of Contents 1 Introduction.......................................................................................... 3 1.1 Features......................................................................................3 1.2 Block Diagram...........................................................................5 2 Pinouts..................................................................................................6 2.1 Package pinouts and ballmap.................................................... 6 2.2 Pin/ball descriptions ................................................................. 8 2.2.1 Pin/ball startup and reset states................................. 8 2.2.2 Power supply and reference voltage pins/balls......... 9 2.2.3 System pins/balls.......................................................12 2.2.4 LVDS pins/balls........................................................13 2.2.5 Generic pins/balls......................................................14 2.2.6 Peripheral input muxing............................................43 3 Electrical characteristics.......................................................................55 3.1 Introduction............................................................................... 55 3.2 165°C junction temperature option........................................... 55 3.3 Absolute maximum ratings....................................................... 55 3.4 Recommended operating conditions......................................... 57 3.5 Thermal characteristics..............................................................58 3.5.1 General notes for specifications at maximum junction temperature................................................. 59 3.6 Electromagnetic compatibility (EMC)...................................... 60 3.7 Electrostatic discharge (ESD) characteristics............................62 3.8 Voltage regulator electrical characteristics............................... 62 3.9 DC electrical characteristics......................................................65 3.10 Supply current characteristics....................................................67 3.11 Temperature sensor................................................................... 69 3.12 Main oscillator electrical characteristics................................... 69 3.13 PLLDIG electrical characteristics............................................. 72 3.14 16 MHz Internal RC Oscillator (IRCOSC) electrical specifications............................................................................. 73 3.15 ADC electrical characteristics................................................... 74 3.16 Flash memory specifications..................................................... 77 3.16.1 Maximum junction temperature 150°C.....................77 3.16.2 Maximum junction temperature 165°C.....................80 3.16.3 Flash memory read wait-state and address-pipeline control settings.......................................................... 84 3.17 SGEN electrical characteristics................................................. 85 3.18 RESET sequence duration.........................................................86 3.19 AC specifications.......................................................................86 3.19.1 Reset pad (EXT_POR, RESET) electrical characteristics............................................................87 3.19.2 WKUP/NMI timing...................................................89 3.19.3 Debug/JTAG/Nexus/Aurora timing..........................89 3.19.4 External interrupt timing (IRQ pin).......................... 96 3.19.5 SPI timing................................................................. 97 3.19.6 LFAST...................................................................... 102 3.19.7 FlexRay..................................................................... 106 3.19.8 Ethernet switching specifications..............................109 4 Obtaining package dimensions.............................................................111 5 Ordering information............................................................................112 6 Document revision history................................................................... 113